Microspatially modulating hydrophilic/hydrophobic property on glass surface using femtosecond laser direct writing
Mingjie Liu,K. Midorikawa,K. Sugioka,Jian Xu
2016-02-08
Abstract:on glass surface using femtosecond laser direct writing Jian Xu, Mingjie Liu, Katsumi Midorikawa and Koji Sugioka RIKEN Center for Advanced Photonics, 2-1 Hirosawa, Wako, Saitama 351-0198, Japan School of Chemistry and Environment, Beihang University, China E-mail: ksugioka@riken.jp Spatial control of hydrophilic/hydrophobic surfaces is of importance in many research fields, such as microfluidics and lab-on-a-chips [1, 2]. Femtosecond (fs) laser micro/nanostructuring has attracted great interest in recent years for wettability modulation on various material surfaces due to its distinct advantages of maskless processing, simple procedure, high precision, and high efficiency [3, 4]. However, few works demonstrated hydrophilic/hydrophobic surface micropatterning of microfluidic substrates such as glass by the fs laser. In this work, we report on creation of hydrophilic micropatterns by fs laser direct writing of hydrophobic glass surfaces. Two types of glass, Foturan and fused silica, are used as host substrates, both of which are chemically modified to hydrophobic surfaces prior to laser irradiation (Fig. 1a). Then, the micropatterned grooves with hydrophilic surfaces are formed due to the fs-laser direct-write ablation [5] (e. g., a square-wave pattern shown in Fig. 1b). The influence of laser direct-write parameters on the linewidths of written patterns is investigated, while results for two different kinds of substrates are compared. By loading liquid mediums such as pure water, dye solutions (Fig. 1c), and nanoparticle solutions onto the one-side end of the created patterns, the solutions can pumplessly flow in laser structured grooves to the other-side end due to the capillary action, which functions a self-flow open microfluidic channel. The applications of this technique to open microfluidics and multifunctional selective metallization are discussed.
Engineering,Materials Science,Physics