Influence of Surface Preparation on Atomic Layer Deposition of Pt Films

Ge Liang,Hu Cheng,Zhu Zhiwei,Zhang Wei,Wu Dongping,Zhang Shili
DOI: https://doi.org/10.1088/1674-4926/33/8/083003
2012-01-01
Journal of Semiconductors
Abstract:We report Pt deposition on a Si substrate by means of atomic layer deposition (ALD) using (methylcyclopentadienyl) trimethylplatinum (CH3 C-5 H-4 Pt(CH3)(3)) and O-2. Silicon substrates with both HF-last and oxidelast surface treatments are employed to investigate the influence of surface preparation on Pt-ALD. A significantly longer incubation time and less homogeneity are observed for Pt growth on the HF-last substrate compared to the oxide-last substrate. An interfacial oxide layer at the Pt-Si interface is found inevitable even with HF treatment of the Si substrate immediately prior to ALD processing. A plausible explanation to the observed difference of Pt-ALD is discussed.
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