Fabrication of a Thermoplastic Multilayer Microfluidic Chip

Jingmin Li,Chong Liu,Xue Ke,Zheng Xu,Meng Li,Yajie Duan,Yan Fan,Liding Wang
DOI: https://doi.org/10.1016/j.jmatprotec.2012.06.022
IF: 6.3
2012-01-01
Journal of Materials Processing Technology
Abstract:“Reservoir unsealed” and “boundary layer separation” are two main issues in the fabrication of a multilayer poly(methyl methacrylate) (PMMA) microfluidic chip. In this paper, embedded sacrificial layer bonding (ESLB) and laser edge welding (LEW) are presented to avoid them. ESLB is performed by inserting a sacrificial-layer into a reservoir to enhance the transfer of bonding pressure among different layers. LEW is performed by using CO2 laser to weld the edge of a bonded multilayer chip. By using these two methods, a three-layer microchip and a five layer micro-mixer are fabricated. Our results demonstrated that ESLB and LEW can be implemented readily in the fabrication of a multilayer thermoplastic microfluidic chip which may facilitate the development of sophisticated microfluidic systems.
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