Deformation and Strength Mechanism of Microchannels in Thin-Film Assisted Bonding Microfluidic Chips
Binni Huang,Wanlin Wang,Huijie Sun,Can Weng
DOI: https://doi.org/10.1007/s00542-024-05791-z
2024-01-01
Microsystem Technologies
Abstract:Microfluidic chips exhibit immense potential across various fields, including biology, chemistry, and medicine. However, one of the primary technical hurdles in their fabrication lies in the bonding process, which is pivotal for elevating the quality and production yield of polymer microfluidic chips. Traditional thermal bonding, involving the application of pressure and temperature, often leads to considerable deformation of the chip’s microchannels, thus impeding the progress of the technology. To overcome this significant challenge, a novel thin-film assisted thermal bonding technique tailored for microfluidic chips is introduced. This innovative method, backed by fundamental research and technical advancements, significantly reduces channel deformation while enhancing bond strength, thereby ensuring precise thermal bonding of polymer microfluidic chips. In this study, polymethylmethacrylate(PMMA)-based microfluidic chips featuring micron-scale channel structures were employed to investigate thermal deformation and its regulatory mechanisms. This investigation focused on exploring how interfacial thermal loads affect microchannel deformation and elucidating the role of bonding parameters in determining the moulding quality of the chip. The outcome of this research achieved a remarkable final bond strength of 0.95 MPa, with microchannel deformation limited to just 6.2