Determination of the Copper Diffusion-Coefficient in Silicon from Transient Ion-Drift

T. Heiser,A. Mesli
DOI: https://doi.org/10.1007/bf00332285
1993-01-01
Abstract:We use the transient ion drift in a depletion region of a Schottky barrier to determine ion diffusivities at moderate temperatures. The pulsed reverse bias leads to temperature dependent capacitance transients similar to deep level carrier emission transients. A simple theoretical model together with classical transient signal analysis provide the means to extract the ion diffusion constant. When applied to copper in silicon, diffusion data are obtained in a not yet investigated temperature range (280–400 K) which agree well with both low and high temperature diffusion data.
What problem does this paper attempt to address?