Abstract:Oxidative etching possesses an enriched flexibility and atomic-level accuracy in tailoring the size, morphology, surface structure, and composition of colloidal nanocrystals toward their catalytic and sensing applications. In this work, we choose one-dimensional penta-twinned Pd nanorods as a model system and apply liquid cell transmission electron microscopy (LCTEM) to investigate the detailed nanoscale etching process under different solution environments, which are DI water/e-beam (weakly oxidative), sodium chloride (NaCl) solution/e-beam (moderately oxidative), and ferric chloride (FeCl3) solution/e-beam (strongly oxidative), respectively. Increasing the oxidative strength of solution alone accelerates the dissolution kinetics and drives the system from the (near)-equilibrium etching, where nanorods appear in flat and low-indexed ends (for DI water/e-beam) to nonequilibrium etching with slender tips formed as intermediate products (for FeCl3/e-beam). Under a nonequilibrium etching condition, both symmetric and asymmetric etching occurred, that is, the penta-twinned structure either retained (for symmetric etching) or dissolved to a fourfold-, threefold-, and twofold-twinned and single-crystalline structure (for asymmetric etching), depending on the structural defects-induced strain distribution. The formation of slender tips of different structures can be further understood via energetic analysis and strain relaxation. In particular, in situ LCTEM results were successfully reproduced by flask system-based etching experiments; hence, direct correlations were built between LCTEM and conventional colloidal etching reactions. This work comprehends the present understanding on the synergetic roles of structure characteristics and solution chemistry for the etching of multiply twinned nanoparticles toward their precise controlled synthesis and practical applications.

Study of Etching Rate with Sacrificial Layer's Thickness in Nanometer

Etching Rate Of Sacriflcial Layer In Nanometer

A Study On Etching Profiles Of Sacrificial Layers

Sacrificial layer etching in bubble structure

Sacrificial Layer Etching Process in Joint Channels

Modified Model for Sacrificial Layer Etching

Effect of annealing on etching profile of sacrificial layer and etching rate

A Modified Model for Etching a Sacrificial Layer in Bubble Structures

Modified Release-Etch Modeling for Complex Sacrificial Layer Structures

TDC Model for PSG Sacrificial Layer Etching with Hydrofluoric Acid

Synergy Between Structure Characteristics and the Solution Chemistry in a Near/Non-Equilibrium Oxidative Etching of Penta-Twinned Palladium Nanorods

Effect of Width Ratio on the Etching Behavior of Joint Channel Structure

The Effects of Diffusion Coefficient on the Etching Process of Sacrificial Oxide Layers

Electric Double Layer Effect in a Nano-Scale SiO2sacrificial Layer Etching Process and Its Application in Nanowire Fabrication

Efficient solution to selective wet etching of ultra-thick copper sacrificial layer with high selective etching ratio

Researches on selective electrochemical-etching for Cu/Ni sacrificial layers

A Sacrificial Layer Etching Method Applied in Surface Micromachining Using Agitated BHF and Glycerol Solution

Study on the layering phenomenon of SiC porous layer fabricated by constant current electrochemical etching

An innovative methodology for monitoring the sacrificial layer removal process in MEMS structures

Study of the Nanometer Scale Polysilicon Micro Structure Etching

Study on HF Vapor-Phase Etching for Suspended Nano Structure Fabrication