Preparation and Properties of TiO2/Al2O3 Stacked High k Gate Dielectric Films

Ling Huiqin,Ding Dongyan,Zhou Xiaoqiang,Li Ming,Mao Dali
DOI: https://doi.org/10.3321/j.issn:1002-185X.2008.z1.084
2008-01-01
Rare Metal Materials and Engineering
Abstract:TiO2/Al2O3 stacked high k dielectric films were deposited by RF-magneton sputtering. The effect of post-anneal on the morphology, equivalent oxide thickness, fixed charge density and the interfacial diffusion of the films were studied by atomic force microscopy, X ray diffraction, precise impedance analyzer, picoammeter and Auger electron spectroscopy. The TiO2 film crystallized upon annealing above 400 degrees C. The post-annealing improved the surface roughness, decreased the leakage current and the fixed charge density of the stacked films. Moreover, the post-annealing enhanced the diffusion of Ti to Al2O3 layer. The very thin Al2O3 layer could not block Ti from diffusion through the Al2O3 layer to the substrate.
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