A Study on the Electrodeposition Behaviors of Nickel-iron-tungsten Alloy

XU Chao,CHEN Fan-cai,WU Dao-ming,WANG Zi-tian,LI Wen-zhen,LI Lin
DOI: https://doi.org/10.3969/j.issn.1001-3660.2010.05.008
2010-01-01
Surface Technology
Abstract:The electrodeposition mechanism of nickel-iron-tungsten alloy were studied by the methods of electrochemistry,and the micromorphology and composition of nickel-iron-tungsten alloy were characterized.Cyclic voltammogram indicated that the electrodeposition of nickel-iron-tungsten alloy was irreversible growth process,and the electrocrystallization mechanism didn't change with the variety of the concentration of WO42-.Chronoamperometric results indicated that the electrodeposition of nickel-iron-tungsten alloy at copper electrode belonged to a three-dimensional instantaneous nucleation mechanism.SEM images of electrodeposit showed that the nickel-iron-tungsten alloy was made of lots of crystalline grain which was several tens nanometers,and the atom composition was 58.76%Ni,32.72%Fe,8.52 %W.
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