ELASTO-PLASTIC COHESIVE ZONE MODELING OF DELAMINATION OF Si/Cu INTERFACE IN A NANO-CANTILEVER

Pengfei Zhao,Fulin Shang,Yabin Yan,Kongjun Wei

2011-01-01

Abstract:Previous experimental tests [Thin Solid Films 516:1925-1930] have shown that nano-cantilever Si/Cu/SiN/Pt/C tends to delaminate along the interface between Cu and Si layers when subject to monotonically bending load,the measured load-displacement curve shows a clear nonlinear behavior.Based on the continuum mechanics model,this study carries out numerical simulation and analysis of the crack initiation and propagation along the interface Si/Cu,which was observed in the above tests.Exponential type cohesive zone model(CZM) using finite element method was adopted to characterize the constitutive relationship of the interface Si/Cu,where Cu layer obeys either linear elastic or Ramberg-Osgood elasto-plastic constitutive relationship.The characteristic parameters of interface bonding strength are extracted through calibration via experimental results.The simulation results show that(i) cohesive strength and cohesive energy are the dominating CZM parameters,and exponential CZM is suitable to describe the interfacial delamination between Cu and Si layers when Cu layer is linear elastic;(ii) compared with bulk Cu,nano-scale Cu has a much higher yield stress and hardening rate,which leads to little plastic deformation of the nano-cantilever specimen during the whole delamination process.These predictions are in accordance with the experimental results.