Unfolding an Elusive Area-Selective Deposition Process: Atomic Layer Deposition of TiO 2 and TiON on SiN vs SiO 2
Alfredo Mameli,Kanda Tapily,Jie Shen,Fred Roozeboom,Mengcheng Lu,David O’Meara,Scott P. Semproni,Jiun-Ruey Chen,Robert Clark,Gert Leusink,Scott Clendenning
DOI: https://doi.org/10.1021/acsami.3c17917
IF: 9.5
2024-03-06
ACS Applied Materials & Interfaces
Abstract:Area-selective atomic layer deposition (AS-ALD) processes for TiO(2) and TiON on SiN as the growth area vs SiO(2) as the nongrowth area are demonstrated on patterns created by state-of-the-art 300 mm semiconductor wafer fabrication. The processes consist of an in situ CF(4)/N(2) plasma etching step that has the dual role of removing the SiN native oxide and passivating the SiO(2) surface with fluorinated species, thus rendering the latter surface less reactive toward titanium tetrachloride...
materials science, multidisciplinary,nanoscience & nanotechnology