Luminescence of Dislocation Network in Directly Bonded Silicon Wafers

X. Yu,M. Kittler,O. F. Vyvenko,W. Seifert,T. Arguirov,T. Wilheim,M. Reiche
DOI: https://doi.org/10.1002/pssc.200675452
2007-01-01
Abstract:The luminescence behaviors of dislocation network in directly bonded silicon wafers have been investigated in this paper. The individual dislocations were observed in the sample bonded with extreme small misorientation angles by electron beam induced current (EBIC) technique. The temperature dependence of EBIC contrast of the dislocation lines showed that its contamination degree was smaller than 10(4)/cm. The cathodoluminescence (CL) from the dislocation networks showed D1-line existed in all the bonded samples, often along with D2-line. The D3/D4-lines could also be obtained by tuning the misorientations. Meanwhile, the application of an external bias can effectively enhance the luminescence. Furthermore, a metal-insulator (SiOx, x < 2)-semiconductor light-emitting diode (MOS-LED) based on the bonded silicon wafer was demonstrated.
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