Abstract:In this study, we regulate adhesion between thin metal films to produce a large-area vacuum nanogap for electron tunneling. Multilayer structures comprising thin metal films with adjustable adhesion were fabricated. The Cu/Ag/Ti/Si structures were grown on Si substrates and include thin Ti and Ag films and a thick Cu layer. The Ag and Ti films were deposited on the Si substrate under vacuum, and a thick Cu layer was subsequently electroplated onto the Ag surface. Later, the sandwich was separated and a vacuum nanogap was opened to produce two Ag/Cu and Ti/Si conformal electrodes. The adhesion strength between the Ti and Ag films was precisely adjusted by exposing the structures to dry O2 after Ti growth but before Ag growth. The resulting adhesion needed to be sufficiently high to allow electroplating of Cu and sufficiently low to allow subsequent separation. Either heating or cooling was used to separate the sandwiches. T he structures separated as a result of the different thermal expansion parameters of the Si and Cu electrodes and the low adhesion between the Ti and Ag layers. After separation, the Ag and Ti surfaces were analyzed optically using a Michelson interferometer. Adhesion regulation and optimization of the electroplating regime allowed fabrication of two conformal electrodes with a nanogap smaller than 5 nm and an area larger than 7 mm2. Such electrodes can be used for efficient energy conversion and cooling in the mixed thermionic and thermotunneling regime.

Formation of Nanogaps by Nanoscale Cu Electrodeposition and Dissolution

Finely Tuning Metallic Nanogap Size with Electrodeposition by Utilizing High‐Frequency Impedance in Feedback

Electrochemical Approach for Fabricating Nanogap Electrodes with Well Controllable Separation

Real Time and in Situ Control of the Gap Size of Nanoelectrodes for Molecular Devices

Fabrication of A Nano-Scale Gap by Selective Chemical Deposition

Quantized Tunneling Current in the Metallic Nanogaps Formed by Electrodeposition and Etching

Electroplating of conformal electrodes for vacuum nanogap tunnel junction

Vacuum nanogap formation in multilayer structures by an adhesion-controlled process

Understanding Capacitance Variation in Sub-Nanometer Pores by In-Situ Tuning of Interlayer Constrictions.

Fabrication of Sub-10 Nm Gap by Using Electron Beam Lithography

Electrochemical Etching-Assisted Fabrication of Quantum Tunneling Sensing Probes with Controlled Nanogap Width

Electrochemical actuation behaviors of bulk nanoporous copper with a hierarchical structure

Self-aligned Electrodes for Suspended Carbon Nanotube Structures

MOEMS 3D microstructure preparation method based on novel localized electrochemical deposition

Periodic Structures of Randomly Distributed Cu/Cu2O Nanograins and Periodic Variations of Cell Voltage in Copper Electrodeposition

Nanogap Structures: Large‐Scale Sub‐1‐nm Random Gaps Approaching the Quantum Upper Limit for Quantitative Chemical Sensing (Advanced Optical Materials 24/2020)

A 30 Nm Nanopore Electrode: Facile Fabrication and Direct Insights into the Intrinsic Feature of Single Nanoparticle Collisions.

In-situ control of on-chip angstrom gaps, atomic switches, and molecular junctions by light irradiation

Tuning Cutcnq Nanostructures on Patterned Copper Films

Experimental Investigation of Electrochemical Capacitive Responses versus Pore Geometries through Artificial Nanotubes

Controllable Growth of Gold Nanowires and Nanoactuators Via High-Frequency AC Electrodeposition