Abstract:Three-dimensional integrated circuits (3D ICs) make use of the vertical dimension for smaller footprint, higher speed, lower power consumption, and better timing performance. In 3D ICs, the inter-tier-via (ITV) is a critical enabling technique because it forms vertical signal and power paths. Accordingly, it is imperative to accurately and efficiently extract the electrostatic capacitances of ITVs using field solvers. Unfortunately, the cylindrical via shape presents major challenges to most of the existing methods. To address this issue, we develop a novel floating random walk (FRW) method by rotating the transition cube to suit the cylindrical surface and devising a special space management technique. Experiments on typical ITV structures suggest that the proposed techniques can accelerate the existing FRW and boundary element method (BEM) based algorithms by up to 20X and 180X, respectively, without loss of accuracy. In addition, compared with the naïve square approximation approach, our techniques can reduce the error by 10X. Large and multi-dielectric structures have been tested to demonstrate the versatility of the proposed techniques.

Multi-Layered Green Function Approach to 3D Capacitance Extraction with Substrate Loss

Efficient 3-D Capacitance Extraction Considering Lossy Substrate with Multilayered Green's Function

Capacitance extraction of high-density 3D interconnects using finite element method

Capacitance Extraction of Three-Dimensional Interconnects Using Element-By-Element Finite Element Method (Ebe-Fem) and Preconditioned Conjugate Gradient (pcg) Technique

Parasitics Extraction Involving 3-D Conductors Based on Multi-Layered Green's Function

Numerical characterization of multi-dielectric green's function for floating random walk based capacitance extraction

A new multilevel Green's function interpolation method for large-scale low-frequency EM simulations

A New Model Library Approach to Extract VLSI Interconnect Capacitance

Capacitance extraction of on-chip circular stacked inductors

COMBING MULTILEVEL GREEN'S FUNCTION INTERPOLATION METHOD WITH VOLUME LOOP BASES FOR INDUCTANCE EXTRACTION PROBLEMS

A New Closed-Form Expression For Capacitive Coupling Of Lossy Substrate

Quasi-Static Derived Physically Expressive Circuit Model for Lossy Integrated RF Passives

Improved Approach to Analysis of Substrate Coupling Based on Multilayered Green'S Function

Analytical Formulas for the Barrel-Plate and Pad-Plate Capacitance in the Physics-Based Via Circuit Model for Signal Integrity Analysis of PCBs

Capacitive coupling analysis of TSV array in 3D packaging

Fast Floating Random Walk Algorithm Formulti-Dielectric Capacitance Extraction with Numerical Characterization of Green's Functions

Random Walk Based Capacitance Extraction for 3D ICs with Cylindrical Inter-Tier-vias

Enhanced Qmm-Bem Solver For 3-D Finite-Domain Capacitance Extraction With Multilayered Dielectrics

A Simple Approach to Closed-Form Green's Functions of Microstrip Structures

Improved Pre-Characterization Method for the Random Walk Based Capacitance Extraction of Multi-Dielectric VLSI Interconnects

A New Approach to 3D Parasitic Capacitance Extraction of Interconnects with Building Blocks of Dielectric