A New Approach to 3D Parasitic Capacitance Extraction of Interconnects with Building Blocks of Dielectric

戴斌华,陆涛涛,王泽毅,洪先龙
DOI: https://doi.org/10.3321/j.issn:1003-9775.2004.03.015
2004-01-01
Abstract:A novel concept of building block of dielectric is introduced to facilitate preprocessing the 3D interconnect structure and building a library of BBD for fast capacitance extraction. With a process description file it can handle complex structure as conformal and non-orthogonal wire. Numerical results present that the capacitance extraction algorithm based on BBD is at least 30 times faster than SpiceLink without loss of precision.
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