Relationships between interfacial interaction, electrode formulation and cofiring mismatch of relaxor-based multilayer ceramic devices

Ruzhong Zuo,Longtu Li,Zhilun Gui
DOI: https://doi.org/10.1023/A:1011258321843
2001-01-01
Abstract:The drive for high reliability of multilayer ceramic chips requires perfect cofired heterogeneous interfaces that can be obtained by a reliable cofiring processing. The cofiring behavior between Pb-based relaxor ferroelectric and Ag-Pd electrode was investigated. The results obtained indicated evident interdiffusion and chemical reactions at the interface. These interfacial interactions caused the formation of an interlayer, especially for the addition of a suitable amount of ceramic powder into the Ag-Pd paste. An analysis of interfacial stress distribution demonstrated that a moderate interfacial layer tends to alleviate the cofiring mismatch between ceramic layers and electrode layer. In addition, the type of cofired interface between the ferroelectric and the Ag-Pd alloy electrode was confirmed to be a mixture of diffusion and compound type.
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