Abstract:The Ba(Ti,Zr)O3‐based multilayer ceramic capacitors (MLCCs) with Ni electrodes, which meet the Electronic Industry Association Y5V standard (from −30° to 85°C, at a temperature capacitance coefficient between −82% and 22%), have been studied in view of the electrode‐ceramic inter‐diffusion by several microstructual techniques (scanning electron microscopy/transmission electron microscopy/high‐resolution transmission electron microscopy (HRTEM)) with an energy‐dispersive X‐ray spectrometer (EDS). The EDS analysis shows that the elements' inter‐diffusion took place along the metal–dielectric interface and the migration of Ni toward the dielectric layers dominated this process. The incorporation of Ni did not transform the crystal structure but introduced lattice distortions, which were characterized by HRTEM, X‐ray diffraction, and EDS. The degree of Ni diffusion in the sample with the thinner dielectric layer was more severe. It was concluded from the results that the Ni diffusion is related to the formation of oxygen vacancies after the annealing process, which should be a noticeable factor in the degradation behavior and reliability of base metal electrode MLCCs. The factors influencing the inter‐diffusion are also discussed.

Effect of Interactions at the Cofired Interface of Electrode/Ceramics on the Reliability of Lead-Based Multilayer Ceramic Capacitors

TEM and EDS investigation of heterogeneous interfaces in cofired multilayer ceramic capacitors

Influence of inner electrode on the microstructure of BZN based MLC

Direct current-voltage failure in lead magnesium niobate-based multilayer ceramic capacitors

Co-firing Behavior of ZnTiO3 Dielectric Ceramics/ag Composites for MLCCs

Characteristics and Effects of Interfacial Interdiffusion in Composite Multilayer Ceramic Capacitors

Mechanism and Controlling of Silver Migration in Cofired Multilayer Devices with Ag-Pd Inner Electrodes

Interactions at the Cofired Interface of Ag/Pd Electrode and Lead-Based Ferroelectrics

Investigation on the inter-diffusion and microstructure in multilayer ceramic capacitors

Study on the Interdiffusion in Base-Metal-electrode MLCCs

Failure Mechanism of a Low‐Temperature‐Cofired Ceramic Capacitor with an Inner Ag Electrode

Electrode–Ceramic Inter‐Diffusion of Ba(Ti,Zr)O3‐Based Y5V MLCCs with Ni Electrodes

Li2CO3-Coated Ni Particles for the Inner Electrodes of Multilayer Ceramic Capacitors: Evaluation of Lifetime

Effects of Additives on the Interfacial Microstructure of Cofired Electrode‐Ceramic Multilayer Systems

Influence of silver migration on dielectric properties and reliability of relaxor based MLCCs

Investigation Of Interdiffusion In Ba(Ti,Zr)O-3-Based Y5v Multilayer Ceramic Capacitors With Ni Electrodes

Interfacial Diffusion Behavior in Ni-Batio3 Mlccs with Ultra-Thin Active Layers

Sintering behavior of Ag/Pd internal electrode paste for multilayer ceramic capacitor

Influence of electroless nickel plating on multilayer ceramic capacitors and the implications for reliability in multilayer ceramic capacitors

Investigation of Ceramic-Metal Interfacial Behavior in Base Metal Electrode MLCC

Effects of A/B-Site Co-Doping on Microstructure and Dielectric Thermal Stability of AgNbO3 Ceramics