Interfacial Diffusion Behavior in Ni-Batio3 Mlccs with Ultra-Thin Active Layers

Huiling Gong,Xiaohui Wang,Zhibin Tian,Hui Zhang,Longtu Li

DOI: https://doi.org/10.1007/s13391-013-3199-7

IF: 3.151

2014-01-01

Electronic Materials Letters

Abstract:The interfacial structure and diffusion behavior between the dielectric layers (BaTiO 3 ) and internal electrode layers (Ni) in X5R-type multilayer ceramic capacitors (MLCCs, from −55°C to 85°C, at a temperature capacitance coefficient within ±15%) with ultra-thin active layers ( T = 1–3 µm) have been investigated by several microstructural techniques (SEM/TEM/HRTEM) with energy-dispersive x-ray spectroscopy (EDS). In the MLCC samples with different active layer thicknesses (1–3 µm), weak interfacial diffusion was observed between BaTiO 3 and Ni. It was also found that the diffusion capability of Ni into the BaTiO 3 layer was stronger than that of BaTiO 3 to the Ni electrode, which indicated that the diffusion of Ni was the dominant factor for the interfacial diffusion behavior in the ultra-thin layered MLCCs. The mechanism of Ni diffusion is discussed in this study as well.