Abstract:In this work, we developed a new potassium permanganate oxidation modification-ion exchangereduction (OIR) process which is a mild surface ion exchange self-metallization method to fabricate conductive silver coatings with ultra-low silver consumption on polyimide film. Firstly, a hydrophilic manganese oxide modified layer loaded with K+ as a novel silver ion carrier was prepared on polyimide film by potassium permanganate oxidation modification. Secondly, Ag+ was loaded onto the manganese oxide modified layer by the ion exchange effect. Thirdly, a conductive silver layer was fabricated successfully with the reduction of Ag+ and the redox dissolution of the manganese oxide modified layer by a reduction process. Finally, the silver coating prepared by the OIR method has good adhesion, an 80 nm thickness value (0.56 wt% silver consumption), and a sheet resistance value of 261 Omega sq(-1). At the same time, characterization of the film during the preparation process and the influence of the O, I and R process times on the performance of the silver coating were studied systematically. Compared with the traditional fabrication methods of conductive silver coatings, this new technology does not require a sintering process, causes almost no damage to the chemical structure of the polyimide molecules and leaves no residual modifier. Importantly, the silver layer prepared by this method has an ultra-low silver consumption value and better conductivity at the same time. Moreover, the silver layer fabricated by this method can be used as the bottom layer of the electroplating layer in a more economical way in flexible printed circuit boards (FPCBs) and may have many potential applications in various areas.

Preparation of Highly Reflective and Conductive Metallized Polyimide Films Through Surface Modification: Processing, Morphology and Properties

Direct Ion Exchange Self‐Metallization: A Novel and Efficient Route for the Preparation of Double‐Surface‐Silvered Polyimide Films

A Facile Method for Preparing Highly Conductive and Reflective Surface-Silvered Polyimide Films

Reflective and conductive surface-silvered polyimide films prepared by surface graft copolymerization and electroless plating

Preparation and Dielectric Properties of Polyimide/silica Nanocomposite Films Prepared from Sol–gel and Blending Process

Preparation of surface bound silver nanoparticles on polyimide by surface modification method and its application on electroless metal deposition

Conductive silver coatings with ultra-low silver consumption on polyimide film via a mild surface ion exchange self-metallization method

Superhydrophobic Modification of Polyimide Films Based on Gold-Coated Porous Silver Nanostructures and Self-Assembled Monolayers

PREPARATION AND STUDY ON STRUCTURE OF THE POLYIMIDE/SILICA HYBRID AND NANOCOMPOSITE FILMS

Fabrication of Polyimide Composite Film with Both Magnetic and Surface Conductive Properties

Silica/polyimide Hybrids and Their Dielectric Properties. I. Preparation with an Improved Sol–gel Process with Poly(amic Acid) As the Precursor

Preparation of Electrically Conductive Polyimide/Silver Composite Fibers Via In-Situ Surface Treatment

Fabrication of Surface Silvered Polyimide/iron Oxide Composite Films with Both Superparamagnetism and Electrical Conductivity

Surface Modification with Special Morphology for the Metallization of Polyimide Film

Selective Patterning of Conductive Silver on Polyimide Film by Localized Microplasma Reduction and Electroless Deposition

In-Situ Self-Encapsulated Flexible Multi-Layered Poly (imide Siloxane) Copolymer Film with Resistance to Atomic Oxygen

Superhydrophobic Polyimide Films With A Hierarchical Topography: Combined Replica Molding And Layer-By-Layer Assembly

Super-high interface adhesion through silver/polyimide heterojunction

Conductive silver patterns on polyimide substrates by using an alkali paint modification–ion exchange–reduction (AIR) process via low requirements mask technology

Preparation of Transparent Antistatic Multifunctional Superhydrophobic Film

Adhesion-Enhanced Flexible Conductive Metal Patterns on Polyimide Substrate Through Direct Writing Catalysts with Novel Surface-Modification Electroless Deposition