Abstract:Diffusion and segregation behavior of hydrogen and oxygen in silicon carbide subjected to H implantation and subsequent annealing were studied with a number of analytical techniques including Secondary Ion Mass Spectrometry (SIMS), Rutherford backscattering spectrometry in channeling geometry, field emission scanning electron microscopy, optical microscopy, cross-sectional transmission electron microscopy, and atomic force microscopy. H+ implantation was carried out with energies of 200 keV, 500 keV, or 1 MeV to doses of 1 × 1016, 1 × 1017, or 2 × 1017 ion/cm2, and thermal treatment was conducted in flowing argon for 1 to 2 h at temperatures of 740, 780, 1000, or 1100 °C. The process of migration and eventual loss of hydrogen in a point defect regime is postulated to proceed to a large extent through ionized vacancies. This conclusion was derived from the observed substantial difference in H mobilities in n- vs. p-type SiC as the population of ionized vacancies is governed by the Fermi-Dirac statistics, i.e., the position of the Fermi level. For higher doses, a well defined buried planar zone forms in SiC at the maximum of deposited energy, comprising numerous microvoids and platelets that are trapping sites for hydrogen atoms. At a certain temperature, a more or less complete exfoliation of the implanted layer is observed. For a 1 MeV implant heated to 1100 °C in nominally pure argon, SIMS profiling reveals a considerable oxygen peak of 1016 O atoms/cm2 situated at a depth close to that of the peak of the implanted H+. Similarly, 1100 °C annealing of a 200 keV implant induces the formation of a thin oxide (4 nm), located at the interface between the implanted layer and the substrate as evidenced by both SIMS and HRTEM. The measurements were taken on the part of the sample that remained un-exfoliated. In view of a lack of convincing evidence that a hexagonal SiC might contain substantial amounts of oxygen, further investigation is under way to elucidate its presence in the irradiation-damaged films.

SEM Investigation of Surface Defects Arising at the Formation of a Buried Nitrogen-Containing Layer in Silicon

Role of Nitrogen Related Complexes in the Formation of Defects in Silicon

Oxygen Precipitation in Nitrogen Doped Czochralski Silicon Wafers. I. Formation Mechanisms of Near-Surface and Bulk Defects

Formation of the thermal donors in the hydrogen-implanted nitrogen-doped silicon crystal

Study of nitrogen-related defects by means of gold and hydrogen diffusion investigations

Process-induced defects in nitrogen doped Czochralski silicon in diode processes

Fabrication of nitrogen-hyperdoped silicon by high-pressure gas immersion excimer laser doping

Defect structure of nitrogen doped czochralski silicon annealed under enhanced pressure

Extended Defects in Nitrogen-Doped Czochralski Silicon During Diode Process

Nitrogen Effect on Hydrogen Penetration into Cz Si During Wet Chemical Etching

Revealing the Defects Introduced in N- or Ge-doped Cz-Si by Γirradiation and High Temperature-High Pressure Treatment

Electron Irradiation Induced Defects In Germanium-Doped Czochralski Silicon Substrates And Diodes

Influence of High Pressure Annealing on Electrical Properties of Surface Layer of Neutron Irradiated or Germanium-Doped Czochralski-Grown Silicon

Modeling the processes of formation of defects that form deep levels in SiON/AlGaN/GaN

Defects Evolution in N-Type 4H-Sic Induced by Electron Irradiation and Annealing

Stress Dependent Structure of Annealed Nitrogen-Doped Cz-Si

Radiation-enhanced diffusion of impurity atoms in silicon layers

Diffusion and impurity segregation in hydrogen-implanted silicon carbide

Formation of Silicon on Plasma Synthesized Aluminum Nitride Structure by Ion Cutting

Surface roughening in ion implanted 4H-silicon carbide

Investigation of Plasma Hydrogenation and Trapping Mechanism for Layer Transfer