Interfacial microstructure of Si3N4/Si3N4 brazing joint with Cu–Zn–Ti filler alloy

J. Zhang,X.M. Zhang,Y. Zhou,M. Naka,Atroshenko Svetlana
DOI: https://doi.org/10.1016/j.msea.2007.08.099
2008-01-01
Abstract:In this study, Si3N4 ceramic was jointed by a brazing technique with a Cu–Zn–Ti filler alloy. The interfacial microstructure between Si3N4 ceramic and filler alloy in the Si3N4/Si3N4 joint was observed and analyzed by using electron-probe microanalysis, X-ray diffraction and transmission electron microscopy. The results indicate that there are two reaction layers at the ceramic/filler interface in the joint, which was obtained by brazing at a temperature and holding time of 1223K and 15min, respectively. The layer nearby the Si3N4 ceramic is a TiN layer with an average grain size of 100nm, and the layer nearby the filler alloy is a Ti5Si3Nx layer with an average grain size of 1–2μm. Thickness of the TiN and Ti5Si3Nx layers is about 1μm and 10μm, respectively. The formation mechanism of the reaction layers was discussed. A model showing the microstructure from Si3N4 ceramic to filler alloy in the Si3N4/Si3N4 joint was provided as: Si3N4 ceramic/TiN reaction layer/Ti5Si3Nx reaction layer/Cu–Zn solution.
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