A novel high entropy CoFeCrNiCu alloy filler to braze SiC ceramics

Gang Wang,Yunlong Yang,Rujie He,Caiwang Tan,Marko Huttula,Wei Cao

DOI: https://doi.org/10.1016/j.jeurceramsoc.2020.03.044

IF: 5.7

2020-08-01

Journal of the European Ceramic Society

Abstract:<p>In order to reduce intermetallic compound formations in brazed joints, a CoFeCrNiCu high entropy alloy was invented and employed to braze SiC ceramics. Results show that SiC ceramics were tightly and strongly brazed with the CoFeCrNiCu filler. Microstructure, phase and shear strength were systematically studied for joints brazed at different temperature. Main compositions were identified as high-entropy FCC, Cu(s, s), Si(s, s), and Cr₂₃C₆ phases, regardless the brazing temperature differences. After being brazed at 1453 K, the joint reached a maximum shear strength of 60 MPa, much higher than those brazed with conventional AgCuTi filler. Thanks to high entropy effect of CoFeCrNiCu filler, random solid solution turned out in the seam and benefitted joint quality. The successful use of CoFeCrNiCu high entropy alloy as fillers can expand the application range of high entropy alloys and provide a new filler system to braze ceramics.</p>

materials science, ceramics

What problem does this paper attempt to address?

The problem this paper attempts to address is the development of a novel high-entropy alloy (CoFeCrNiCu) as a brazing filler metal for joining silicon carbide (SiC) ceramics. Traditional brazing fillers such as Ag-Cu-Ti-based and Ni-based fillers, although performing well in some aspects, have the issue of forming a large number of brittle intermetallic compounds, which reduces the quality of the joints. Additionally, these traditional fillers are costly, prone to oxidation, and have low melting points, limiting their application range in high-temperature environments. Therefore, researchers have designed a novel high-entropy alloy filler to overcome these issues and improve the performance of SiC ceramic joints.

Specifically, the main objectives of the paper include:
1. **Developing a novel high-entropy alloy filler**: Preparing and using CoFeCrNiCu high-entropy alloy as a filler for the connection of SiC ceramics.
2. **Evaluating the effect of brazing temperature on performance**: Systematically studying the microstructure, phase structure, and shear strength of the joints at different brazing temperatures.
3. **Optimizing the brazing process**: Determining the optimal brazing conditions to achieve high-quality SiC ceramic joints.
4. **Analyzing the microstructure and mechanical properties of the joints**: Revealing the mechanism of high-entropy alloy filler in SiC ceramic joints through microstructural characterization and mechanical testing.

Through these studies, the paper aims to expand the application range of high-entropy alloys and provide a new efficient filler system for the joining of ceramic materials.