Study on the Process of Cu-Sn-Zn Cyanide-free Gold Imitation Plating

Wang Xiaoying,Bi Chengliang,Li Xinxin,Zhang Baogui
DOI: https://doi.org/10.3969/j.issn.0465-7942.2009.03.012
2009-01-01
Abstract:The best process condition was obtained by improving the formula of the bath and orthogonality experiments while new process of alkaline Cu-Sn-Zn pyrophosphate gold imitation plating system was used.Experimental temperature was 37℃,pH=8.5,plating time was 45 min and electric current density was 0.20 A/dm~2.Setting the rate of plating,appearance condition and corrosion resistance of the coating as a measure standard,the effect of temperature and electric current density on the rate of gold imitation plating and the color of coating as well as the effect of plating time on the thickness of the coating have been discussed.As a result,coating of 20 times as thick as the traditional plating was gained by extending the plating time while other condition was fixed on.
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