A Research on the Performance of Pyrophosphate Cu-Sn Alloy Electroplating Bath

WU Hua-qiang
2011-01-01
Abstract:The pyrophosphate Cu-Sn alloy electroplating bath was comprised of cuprlc pyrophosphate and sodium stannate as the main salts,potassium pyrophosphate as the complexing agent and a self-made additive.The bath formula and technological conditions were optimized through Hull cell experiment.The bath properties including covering power,throwing power,cathodic current efficiency and deposition rate of were also tested.The results show that the covering power attains 98.05 %,the throwing power in depth reaches 100 %,the average cathodic current efficiency is 86.65 %,and the average deposition rate is 59.2 μm/h.The cathodic polarizing ability of electrolyte has been improved and deposition potential of Cu-Sn alloy increased by the additives,obtaining a uniform,compact,bright and level Cu-Sn alloy coating.
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