Abstract:Due to the high integration on vertical stacked layers, power/ground network design becomes one of the critical challenges in 3D IC design. With the leakage-thermal dependency, the increasing on-chip temperature in 3D designs has serious impact on IR drop due to the increased wire resistance and increased leakage current. Power/ground (P/G) TSVs can help to relieve the IR drop violation by vertically connecting the on-chip P/G networks on different layers. However, most previous work only fulfills a margin of the full potential of PG TSVs planning since the P/G grids are restricted in a uniform topology. Besides, the overlook of resistance variation and leakage current will make the results less accurate. In this paper, we present an efficient thermal-aware P/G TSVs planning algorithm based on a sensitivity model with temperature-dependent leakage current considered. The proposed method can overcome the limitation of uniform P/G grid topology and make full use of P/G TSVs planning for the optimization of P/G network by allowing short wires to connect the P/G TSVs to P/G grids in non-uniform topology. Moreover, with resistance variation and increased leakage current caused by high temperature in 3D ICs, more accurate result can be obtained. Both the theoretical analysis and experimental results show the efficiency of our approach. Results show that neglecting thermal impacts on power delivery can underestimate IR drop by about 11%. To relieve the severe IR drop violation, 51.8% more P/G TSVs are needed than the cases without thermal impacts considered. Results also show that our P/G TSV planning based on the sensitivity model can reduce max IR drop by 42.3% and reduce the number of violated nodes by 82.4%.

Leakage-Aware Performance-Driven Tsv-Planning Based on Network Flow Algorithm in 3d Ics

Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs.

Rethinking Thermal Via Planning with Timing-Power-temperature Dependence for 3D ICs

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Efficient Region-Aware P/G TSV Planning for 3D ICs

Efficient Thermal Via Planning Approach and Its Application in 3-D Floorplanning

Thermal-aware P/G TSV Planning for IR Drop Reduction in 3D ICs

LP Based White Space Redistribution for Thermal Via Planning and Performance Optimization in 3D ICs

System-Level Analysis of 3D ICs with Thermal TSVs

Thermal-aware Power Network Design for IR Drop Reduction in 3D ICs.

TSVs-aware floorplanning for 3D integrated circuit

Thermal-aware Cell and Through-Silicon-via Co-Placement for 3D ICs.

Signal Through-the-silicon Via Planning and Pin Assignment for Thermal and Wire Length Optimization in 3D ICs

3D-STAF: Scalable Temperature and Leakage Aware Floorplanning for Three-Dimensional Integrated Circuits

Redundant Vias Insertion for Performance Enhancement in 3D ICs.

Different designs of TSVs for 3D IC: Signal integrity analysis with cascaded scattering matrix

Thermal Via Planning Aware Force-Directed Floorplanning for D ICs

Thermal Effects with Leakage Power Considered in 2D/3D Floorplanning

Integrating Dynamic Thermal Via Planning with 3D Floorplanning Algorithm.

Clustered Fault Tolerance TSV Planning for 3-D Integrated Circuits.

Thermal effects of leakage power in 3D ICs