Abstract:3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-on-chip design, by integrating different modules together with less interference with each other. In this paper, we propose a novel thermal-aware 3D cell placement approach, named T3Place, based on transforming a 2D placement with good wirelength to a 3D placement, with the objectives of half-perimeter wirelength, through-the-silicon (TS) via number and temperature. T3Place is composed of two steps, transformation from a 2D placement to a 3D placement and the refinement of the resulting 3D placement. We proposed and compared several different transformation techniques, including local stacking transformation (LST), folding-2, folding-4 and window-based stacking/folding transformation, and concluded that (i) LST can generate 3D placements with the least wirelength, (ii) the folding-based transformations result in 3D placements with the fewest TS vias, and (iii) the window-based stacking/folding transformations provide good TS via number and wirelength tradeoffs. For example, with four device layers, LST can reduce the wirelength by over 2times compared to the initial 2D placement, while window-based stacking/folding can provide over 10times variation in terms of the TS via number, thus adaptive to different manufacturing ability for TS via density. Moreover, we proposed a novel relaxed conflict-net (RCN) graph-based layer assignment method to further refine the 3D placements. Compared to LST results, thermal-aware RCN graph-based layer assignment algorithm (r = 10%) can further reduce the maximum on-chip temperature by 37%, with only 6% TS via number increase and 8% wirelength increase.

Rethinking Thermal Via Planning with Timing-Power-temperature Dependence for 3D ICs

Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs.

Leakage-Aware Performance-Driven Tsv-Planning Based on Network Flow Algorithm in 3d Ics

Thermal effects of leakage power in 3D ICs

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

LP Based White Space Redistribution for Thermal Via Planning and Performance Optimization in 3D ICs

Thermal Effects with Leakage Power Considered in 2D/3D Floorplanning

Thermal-aware Cell and Through-Silicon-via Co-Placement for 3D ICs.

Thermal-aware P/G TSV Planning for IR Drop Reduction in 3D ICs

Thermal-aware Power Network Design for IR Drop Reduction in 3D ICs.

Electrothermal modelling of through silicon via (TSV) interconnects

Efficient Thermal Via Planning Approach and Its Application in 3-D Floorplanning

System-Level Analysis of 3D ICs with Thermal TSVs

Integrating Dynamic Thermal Via Planning with 3D Floorplanning Algorithm.

Signal Through-the-silicon Via Planning and Pin Assignment for Thermal and Wire Length Optimization in 3D ICs

Thermal Via Planning Aware Force-Directed Floorplanning for D ICs

Thermal-Aware 3D IC Placement Via Transformation

Thermal-Aware 3d Placement

Efficient Thermal-Oriented 3D Floorplanning and Thermal Via Planning for Two-Stacked-die Integration

Efficient Region-Aware P/G TSV Planning for 3D ICs

Optimization of 3D IC Routing Based on Thermal Equalization Analysis