Abstract:The advent of three-dimensional stacked chips has significantly enhanced overall performance but introduced challenges in thermal analysis. To ensure the reliable operation of stacked chips and improve the design efficiency of heat sinks, a comprehensive exploration of thermal management issues, the formulation of practical thermal design principles, and the development of a foundational heat transfer analysis model are imperative. In this study, a three-dimensional stacked module is modeled using FloTHERM finite element simulation technology, and its temperature profile is subsequently simulated. The thermal resistance value of the module's shell is calculated to be 37.25 °C W −1 . Subsequently, utilizing the instantaneous state dual interface method, the junction-to-case thermal resistance of the module is experimentally measured using T3ster equipment. Two identical modules are tested, revealing a junction-to-case resistance value of 39.45 °C W −1 for module No. 1 and 40.50 °C W −1 for module No. 2—both approximately 40 °C W −1 , thereby validating the accuracy and repeatability of the tests. A comparative analysis between the simulated and experimental thermal resistance values indicates an error of approximately − 5.5% for module 1 and − 8.0% for module 2. Further analysis suggests potential sources of error, such as thermal conductivity of the plastic packaging material and hot spot distribution. The paper concludes with simulation-based analyses of plastic packaging material thermal conductivity and hot spot distribution, offering insights for refining the simulation model. This study verifies the correctness of the results obtained by using finite element analysis to build a model for thermal simulation analysis. It has reference value for the thermal simulation analysis and thermal resistance test method of 3D integrated package module.

Thermal effects of leakage power in 3D ICs

Thermal Effects with Leakage Power Considered in 2D/3D Floorplanning

Rethinking Thermal Via Planning with Timing-Power-temperature Dependence for 3D ICs

Leakage-Aware TSV-Planning with Power-Temperature-Delay Dependence in 3D ICs.

Thermal-aware Power Network Design for IR Drop Reduction in 3D ICs.

System-Level Analysis of 3D ICs with Thermal TSVs

Thermal-aware P/G TSV Planning for IR Drop Reduction in 3D ICs

An Efficient Leakage-Aware Thermal Simulation Approach for 3D-Ics Using Corrected Linearized Model and Algebraic Multigrid.

On Mitigation of Side-Channel Attacks in 3D ICs: Decorrelating Thermal Patterns from Power and Activity

Exploring modeling and testing approaches for three-dimensional integrated thermal resistance of chiplets

A Fast and Low Computation Consumption Model for System-Level Thermal Management in 3D IC

Thermal-Aware 3d Placement

A Full Chip Scale Numerical Simulation Method for Thermal Management of 3D IC

3D-STAF: Scalable Temperature and Leakage Aware Floorplanning for Three-Dimensional Integrated Circuits

A thermal-driven force-directed floorplanning algorithm for 3D ICs

Leakage-Aware Performance-Driven Tsv-Planning Based on Network Flow Algorithm in 3d Ics

Thermal Via Planning Aware Force-Directed Floorplanning for D ICs

Three Dimensional ICs Thermal-Driven Test Application Scheme

Thermal-aware Cell and Through-Silicon-via Co-Placement for 3D ICs.

Thermal analysis and heat dissipation optimization of 3D packaging with TSV interposer

Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation.