Abstract:Side-channel attacks (SCAs) are powerful techniques used to recover keys from electronic devices by exploiting various physical leakages, such as power, timing, and heat. Although heat is one of the less frequently analyzed channels due to the high noise associated with thermal traces, it poses a significant and growing threat to the security of very large-scale integrated (VLSI) microsystems, particularly system in package (SiP) technologies. Thermal side-channel attacks (TSCAs) exploit temperature variations, risking not only hardware damage from excessive heat dissipation but also enabling the extraction of sensitive data, like cryptographic keys, by observing thermal patterns. This dual threat underscores the need for a synergistic approach to thermal management and security in designing integrated microsystems. In response, this paper presents a novel approach that improves the early detection of abnormal thermal fluctuations in SiP designs, preventing cybercriminals from exploiting such anomalies to extract sensitive information for malicious purposes. Our approach employs a new concept called Thermal Digital Twin (TDT), which integrates two previously separate methods and techniques, resulting in successful outcomes. It combines the gradient direction sensor scan (GDSSCAN) to capture thermal data from the physical field programmable gate array (FPGA), which guarantees rapid thermal scan with a measurement period that could be close to 10 μs, a resolution of 0.5 ∘C, and a temperature range from −40 ∘C to 140 ∘C; once the data are transmitted in real time to a Digital Twin created in COMSOL Multiphysics® 6.0 for simulation using the Finite Element Method (FEM), the real time required by the CPU to perform all the necessary calculations can extend to several seconds or minutes. This integration allows for a detailed analysis of thermal transfer within the SiP model of our FPGA. Implementation and simulations demonstrate that the Thermal Digital Twin (TDT) approach could reduce the risks associated with TSCA by a significant percentage, thereby enhancing the security of FPGA systems against thermal threats.

On Mitigation of Side-Channel Attacks in 3D ICs: Decorrelating Thermal Patterns from Power and Activity

Mitigating Thermal Side-Channel Vulnerabilities in FPGA-Based SiP Systems Through Advanced Thermal Management and Security Integration Using Thermal Digital Twin (TDT) Technology

System-Level Analysis of 3D ICs with Thermal TSVs

Thermal effects of leakage power in 3D ICs

A Modern Approach to IP Protection and Trojan Prevention: Split Manufacturing for 3D ICs and Obfuscation of Vertical Interconnects

CAD4EM-P: Security-Driven Placement Tools for Electromagnetic Side Channel Protection

SoC It to EM: ElectroMagnetic Side-Channel Attacks on a Complex System-on-Chip

Lightweight Countermeasures Against Static Power Side-Channel Attacks

Best of Both Worlds: Integration of Split Manufacturing and Camouflaging into a Security-Driven CAD Flow for 3D ICs

Physical Design of Monolithic 3 D ICs with Applications to Hardware Security

Thermal Effects with Leakage Power Considered in 2D/3D Floorplanning

A Thermal-Driven Test Application Scheme for 3-Dimensional ICs

Mitigation of Side-channel Attack for Artificial Intelligence (AI) Based ASICs Targeting Scientific Applications

Power Side Channels in Security ICs: Hardware Countermeasures

Hardware-Efficient Logic Camouflaging for Monolithic 3-D ICs.

Power Supply Noise Aware Evaluation Framework for Side Channel Attacks and Countermeasures

A Hardware-Based Countermeasure to Reduce Side-Channel Leakage: Design, Implementation, and Evaluation

Hybrid Thermal Aware Reconfigurable 3d Ic with Dynamic Power Gating Architecture

On Borrowed Time -- Preventing Static Side-Channel Analysis

Co-Designing Hardware/Software to Protect Crypto-Chip Side Channel Analysis at Design Time

Three Dimensional ICs Thermal-Driven Test Application Scheme