Resistive Switching and Memory Effect Based on CuSCN Complex Layer Created Through Interface Reactions

Yuan-Wei Dong,Xin Ji,Wei Xu,Jia-Qi Tang,Peng Guo
DOI: https://doi.org/10.1149/1.3049865
2009-01-01
Abstract:The preparation of copper (I) thiocyanate composite layers through vacuum evaporation of potassium thiocyanate onto a copper layer was investigated. The formation of CuSCN composite film was characterized, and plausible interface reactions were suggested. The Cu/CuSCN composite layer/Al cell exhibited reversible electrical bistability, with an on/off ratio of 10(5)-10(6). The resistive switch mechanism was interpreted with the formation-rupture multifilament model through electrochemical reactions. The low- and high-resistance states follow ohmic conduction and trap-charge-limited conduction, respectively. The CuSCN medium layer and the interface between CuSCN and Cu electrode are proposed to be responsible for nonvolatile memory effect. (C) 2008 The Electrochemical Society. [DOI: 10.1149/1.3049865] All rights reserved.
What problem does this paper attempt to address?