CuSCN-based electrical bistable films fabricated through Cu/NH4SCN solid-liquid interface reactions

Xin Ji,Yuanwei Dong,Wei Xu
2009-01-01
Abstract:A new approach towards in situ growth of CuSCN thin film on Cu substrate was reported through solid-liquid interface reaction between Cu surface and NH4SCN solution. The CuSCN film was tested by Raman spectra, X-ray diffraction (XRD) patterns and scanning electron microscopy (SEM). The as-fabricated Al/CuSCN/Cu device exhibited bipolar electrical memory characteristics with an ON/OFF ratio of 104, and could also be operated successively under pulse modes. The two resistance states could keep stable under long time read voltage. The Al/CuSCN/Cu device may promise its potential for nonvolatile memory application.
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