Abstract:Material deformation caused by the interaction between defects is a significant factor of material fracture failure. The present study employs molecular dynamics simulations of single-void and double-void crystalline Ni atomic systems to investigate inter-void interactions. Furthermore, simulations showing the evolution of dislocations for three different crystallographic orientations are conducted to study the void growth and coalescence. The simulations also consider the effect of the radius of the secondary void on dislocation evolution. The results show that double-void systems are more prone to yield than single-void systems. Further microstructural analysis indicates that the interaction between voids is realized by dislocation reactions. The simulation results of the dislocation evolution of the three orientations reveal that a relationship exists between the evolution of the dislocation density and the stress-strain curve. At the initial stage of dislocation, the dislocation grows slowly, and consists of Shockley partial dislocation. The dislocation growth rate then increases significantly in the sharply declining stage of the stress-strain curve, where most of dislocations are Shockley partial dislocation. Analysis of the dislocation length during the overall simulation indicates that the dislocation length of the [110] orientation is the longest, followed by that of the [111] orientation and the [100] orientation, which has the shortest dislocation length.

Influence of Defects on Mechanical Properties of Bicrystal Copper Grain Boundary Interfaces

Exploration of the Defect’s Effect on the Mechanical Properties of Different Orientated Nanowires

Advanced Numerical Characterization of Mono-Crystalline Copper with Defects

Influence of Defects During the Tensile Deformation of Cu–Al Joint Interfaces at the Nano Scale

Molecular dynamics simulation of the mechanical behavior of bi-crystal interfaces

Tensile Deformation Behavior of Copper Bicrystal with Perpendicular Grain Boundary

Numerical Exploration Of The Defect'S Effect On Mechanical Properties Of Nanowires Under Torsion

Grain boundary effects on the inelastic deformation behavior of bicrystals

Influences of Symmetric Tilt Grain Boundary on the Stretching Deformation Behaviors of Cu Bicrystals

A Close Observation on the Deformation Behavior of Bicrystal Copper under Tensile Loading

Influence of Defects and Crystallographic Orientation on Mechanical Behavior of Nanocrystalline Aluminium

The impact of structural units on the dislocation nucleation of bi-crystal copper grain boundary

Atomistic Simulation Analysis of the Effects of Void Interaction on Void Growth and Coalescence in a Metallic System

Effect of Cu on Strain-Stress Relationship of W Bicrystal Models with Grain Boundary from Molecular Dynamics Simulation

Atomistic investigation of wear mechanisms of a copper bi-crystal

A Dual Deformation Mechanism of Grain Boundary at Different Stress Stages

Molecular dynamics study on the grain boundary dislocation source in nanocrystalline copper under tensile loading

Effects of crystallographic orientations and grain boundaries on nanoscratching behaviour of unique bi-crystal Cu

Effect of Interface on the Deformation of Aluminium Bicrystal: Atomistic Simulation Study

Interfacial Mechanics: From Advanced 2D to 3D Crystalline Materials

Atomic-scale Study of Dislocation-Grain Boundary Interactions in Cu Bicrystal by Berkovich Nanoindentation