Abstract:In this paper, molecular dynamics (MD) simulation was employed to systematically study the tensile deformation behaviors of nano-polycrystalline Cu, nano-polycrystalline Al, nano-polycrystalline Cu/Al, and nano-polycrystalline Cu/Al2Cu/Al models. The influence of interfacial compound Al 2 Cu on the deformation behavior of nano-polycrystalline Cu/Al2Cu/Al layered composite was analyzed in-depth. The results show that the grain boundary sliding dominates the tensile deformation of nano-polycrystalline Al. In contrast, the emergence of a significant number of deformed twins under the 1/6 Shockley dislocation dominates the tensile deformation of nano-polycrystalline Cu. The strength and toughness of the Cu/Al 2 Cu/Al model when Al 2 Cu was added as the interfacial layer are superior to those of nano-polycrystalline Cu/Al without Al 2 Cu. This is mainly because the Al 2 Cu interfacial layer could form gradient strain at the interface structure while narrowing the ductility consumption gap between the matrix Cu and Al in Cu/Al 2 Cu/Al model. Furthermore, Al 2 Cu is a distinctive interfacial layer that has the unique capacity to annihilate dislocations and prevent dislocation expansion in Cu/Al 2 Cu/Al. So, the interface layer Al 2 Cu plays a decisive role in effectively preventing microcrack propagation in the Cu/Al 2 Cu/Al model and promoting the co-deformation between the matrix Cu and Al. This work could provide a design criterion for fabricating Cu/Al layered composite with excellent strength-toughness synergy.

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