Abstract:In this paper, perfect interface model of Al/AlCu alloy and defect interface model of Al/AlCu alloy after cracks were introduced at different positions of the interface were established by using cohesive zone modeling method. Classical molecular dynamics simulation was used to study the deformation behavior and microstructure evolution of Al/AlCu alloy interface model at a strain rate of 0.05 Å/ps and the temperature of 300 K. The simulation results show that perfect interface exhibits a uniform plastic deformation stage due to structural relaxation after yielding, while there is no structural relaxation during the deformation of defect interface and the tensile strength is much lower than that of perfect interface as well. In the process of deformation, stacking faults formed in perfect interface and cracks are generated and expanded in Al matrix, while there was no stacking faults forming along with the expansion and cracking at the position of introduced cracks in defect interface. Massive dislocation nucleation leads to the reduction in stress at the perfect and defect interfaces after yielding. The extension of Shockley partial dislocation and the nucleation of Stair-rod dislocation are the main mechanisms of interface deformation. Densities of Shockley partial dislocation and Stair-rod dislocation decrease with increasing strain before crack propagation. This study enriches the analysis of microstructure evolution of Al/AlCu alloy interface and similar interfaces during deformation.

Influence of Defects During the Tensile Deformation of Cu–Al Joint Interfaces at the Nano Scale

Atomistic Exploration of Deformation Properties of Copper Nanowires with Pre-Existing Defects

Exploration of the Defect’s Effect on the Mechanical Properties of Different Orientated Nanowires

Advanced Numerical Characterization of Mono-Crystalline Copper with Defects

Role of Interfacial Transition Zones in the Fracture of Cu/V Nanolamellar Multilayers

Numerical investigation of fracture behavior of nanostructured Cu with bimodal grain size distribution

Deformation-induced Interfacial Transition Zone in Cu/V Nanolamellar Multilayers

Numerical Exploration Of The Defect'S Effect On Mechanical Properties Of Nanowires Under Torsion

Influence of Defects on Mechanical Properties of Bicrystal Copper Grain Boundary Interfaces

Mechanical behavior and microstructure evolution of Al/AlCu alloy interface

Molecular dynamics simulation of the mechanical behavior of bi-crystal interfaces

Fracture Behavior of Functionally Graded Joint Interfaces Between Copper and Aluminum at Nano-Scale

Molecular Dynamics Study on Mechanical Behaviors of Ti/Ni Nanolaminate with a Pre-Existing Void

Effect of Interface Type on Deformation Mechanisms of Γ-Tial Alloy under Different Temperatures and Strain Rates by Molecular Dynamics Simulation

Influence of Defects and Crystallographic Orientation on Mechanical Behavior of Nanocrystalline Aluminium

Atomistic Investigations of Tensile and Shear Mechanical Properties of Nanotwinned Copper with Embedded Defects

Dislocation-based mechanical responses and deformation mechanisms of Al/Cu heterointerfaces: A computational study via molecular dynamics simulations

Molecular Dynamics Study of Uniaxial Deformation in Perfect and Defective Aluminum

Grain Boundary Effects on Plastic Deformation and Fracture Mechanisms in Cu Nanowires: Molecular Dynamics Simulations

Study on the Influence of Defects on Fracture Mechanical Behavior of Cu/SAC305/Cu Solder Joint

Mechanical Behavior of Cu-W Interface Systems Upon Tensile Loading from Molecular Dynamics Simulations