Abstract:Cyclic deformation behaviour of a [(4) over bar 15 20]-[18 (2) over bar 7] copper bicrystal with a tilting Sigma = 19b grain boundary (GB) was investigated in the axial plastic strain range 1.5 x 10(-4) -2.13 x 10(-3) at room temperature in air. The primary slip planes (111) within the G(1)[(4) over bar 15 20] and G(2)[18 (2) over bar7] grains in the bicrystal were designed to be coplanar in order to reveal the interaction of slip bands with the GB. The results show that the cyclic stress-strain curve of the bicrystal displays a plateau region with axial saturation stresses of 61.6-63.5 MPa over the applied strain range. This result is similar to that for a single-slip-oriented copper single crystal, indicating that the GB has little effect on the saturation stress. After cyclic deformation, the surface morphology of the bicrystal exhibits the following features. Firstly, only the primary slip system was activated in both grains. Secondly, the primary slip bands on the four surfaces of the two grains show a good one-to-one relationship across the GB, indicating that surface slip bands can transfer through it. Thirdly, secondary slip systems were not activated, even in the vicinity of the GB. Dislocation patterns of the bicrystal were observed by the electron channelling contrast technique. The two-phase structure of persistent slip bands (PSBs) and matrix (or veins) formed in both grains. The ladder-like PSBs were observed to transfer through the GB continuously on one surface of the bicrystal but piled-up at the GB on the other surface, showing a discontinuous dislocation distribution next to the GB. Several kinds of interaction between dislocations and the GB were observed on the common slip plane. The cyclic stress-strain response and the interactions between dislocations, PSBs and the GB are discussed.

A Close Observation on the Deformation Behavior of Bicrystal Copper under Tensile Loading

Tensile Deformation Behavior of Copper Bicrystal with Perpendicular Grain Boundary

Cyclic Deformation Behaviour of A Copper Bicrystal with Common Primary Slip Planes

Deformation Behaviors of Cu Bicrystals with an Inclined Twin Boundary at Multiple Scales

MESOMECHANICAL ANALYSIS OF THE TENSILE DEFORMATION OF PURE COPPER BICRYSTAL

Grain boundary effects on the inelastic deformation behavior of bicrystals

Influences of Symmetric Tilt Grain Boundary on the Stretching Deformation Behaviors of Cu Bicrystals

Cyclic Stress-Strain Response Of A Copper Tricrystal And Bicrystal

Strain localization and fatigue cracking behaviors of Cu bicrystal with an inclined twin boundary

Cyclic Deformation and Fatigue Damage Behavior of Cu Monocrystals, Bicrystals and Tricrystals

Atomistic simulation of tensile deformation behavior of ∑5 tilt grain boundaries in copper bicrystal.

Comparison between cyclic deformation behaviors of non-isoaxial copper tricrystal and bicrystal

Study of Slip-band of Crystalline Grains on the Surface of Polycrystalline Tensile Specimen

The Meso-inhomogeneous Deformation of Pure Copper under Tension–Compression Cyclic Strain Loading

Cyclic Deformation Behavior of [001] Isoaxial Copper Tricrystals, Bicrystals and Single Crystals

Tension/compression asymmetry of grain boundaries with non-planar structure

Influence of Defects on Mechanical Properties of Bicrystal Copper Grain Boundary Interfaces

Analysis of Slip-Band on Specimen Surface of Polycrystalline Copper under Tension

Uniaxial Tensile Behavior of a Bicrystal Copper Nanowire: Structural Characterization with a Fourier Transformation Method

Molecular Dynamics Simulation on Σ5 Grain Boundaries of Copper Bicrystal under Tensile and Shear Deformation

The Stress Characteristics Near to the Grain Boundaries of Bicrystal and Tricrystal Specimens