Oxygen Precipitation in Heavily Phosphorus-Doped Silicon Wafer Annealed at High Temperatures

Yuheng Zeng,Deren Yang,Xiangyang Ma,Jiahe Chen,Duanlin Que
DOI: https://doi.org/10.1016/j.mseb.2008.12.045
2009-01-01
Abstract:Oxygen precipitation in heavily phosphorus-doped (P-doped) Czochralski (CZ) silicon subjected to single-step annealing at high temperatures in the range of 1050–1150°C has been investigated. It was indicated that in the heavily P-doped CZ silicon there were more grown-in oxygen precipitates, thus promoting the generation of induced defects and accelerating the Ostwald ripening of oxygen precipitates during the high temperature annealing, in comparison with the control lightly P-doped CZ silicon with comparable initial oxygen concentration and thermal history. Moreover, it was found that, during the annealing at 1050°C, oxygen precipitation in the outer region about 2.5cm in width was noticeably retarded with respect to that in the inner region across the heavily P-doped CZ silicon wafer. The mechanism for the enhanced formation of grown-in oxygen precipitates and the retardation of oxygen precipitation at high temperature, as mentioned above, has been tentatively explained.
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