Oxygen Precipitation in Heavily Phosphorus-Doped Czochralski Silicon: Effect of Nitrogen Codoping

Yuheng Zeng,Xiangyang Ma,Jiahe Chen,Daxi Tian,Longfei Gong,Deren Yang
DOI: https://doi.org/10.1088/0268-1242/24/10/105030
IF: 2.048
2009-01-01
Semiconductor Science and Technology
Abstract:Oxygen precipitation (OP) in the conventional and nitrogen-codoped heavily phosphorous (P)-doped Czochralski silicon (CZ-Si) wafers subjected to various low- (650-850 degrees C) and high-temperature (1050 degrees C) two-step annealing conditions have been comparatively investigated. It was found that the nucleation annealing at 650 degrees C led to remarkable OP and the resulting bulk micro defect densities were nearly the same in both kinds of silicon wafers. While in the case with the nucleation annealing at 750 or 850 degrees C, the conventional heavily P-doped CZ-Si featured slight OP, in contrast to the nitrogen-codoped counterpart that put up considerably intense OP. The heavily P doping is believed to exert a significant enhancement effect on oxygen precipitate nucleation at 650 degrees C but not at 750 and 850 degrees C, while the nitrogen codoping offers heterogeneous centers for oxygen precipitate nucleation at 750 or 850 degrees C. It is reasonably believed that nitrogen codoping is also an effective pathway to enhance oxygen precipitation in heavily P-doped CZ-Si.
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