Oxygen Precipitation of Nitrogen-Doped Czochralski Silicon Subjected to Multi-Step Thermal Process

Deren Yang,Qiang Ma,Xiangyang Ma,Duanlin Duan
DOI: https://doi.org/10.1149/1.2355748
2006-01-01
Abstract:The effect of nitrogen on oxygen precipitation in nitrogen- doped Czochralski (NCZ) silicon subjected to the simulated CMOS process was investigated. It was found that nitrogen could enhance oxygen precipitation in silicon during the multi- step thermal process. And the denuded zone in NCZ silicon was formed near the surface, through it was not as wide as that in conventional Czochralski (CZ) silicon. It was also found that the loss rates of oxygen concentration in the NCZ silicon pre- annealed by rapid thermal process (RTP) were higher than those in the CZ silicon. In addition, during the multi-step process the oxygen concentrations in the CZ silicon and NCZ silicon after the multi-step pre-annealing, which could create denuded zone, changed slightly.
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