Effect of Nitrogen Doping on Oxygen Precipitate Profiles in Czochralski Silicon Wafer

Can Cui,Deren Yang,Xiangyang Ma,Duanlin Que
DOI: https://doi.org/10.1143/jjap.45.4903
IF: 1.5
2006-01-01
Japanese Journal of Applied Physics
Abstract:The effect of nitrogen doping on the profiles of oxygen precipitates in Czochralski (CZ) silicon subjected to conventional annealing and rapid thermal annealing (RTA) has been investigated. After conventional high-low-high three-step annealing (1150 degrees C 4 h + 650 degrees C 128 h + 1050 degrees C, 16 h), it was found that an M-like oxygen precipitate profile existed in the cross section of a nitrogen-doped CZ silicon (NCZ-Si) wafer; however, this was not the case in conventional CZ silicon (CZ-Si) wafers. In contrast to conventional annealing, after rapid thermal annealing (RTA) followed by a low-high two-step annealing (800 degrees C, 8 h + 1050 degrees C 16 h), an M-like oxygen precipitate profile existed in the cross section of the CZ-Si wafer but not in the NCZ-Si wafer. It is suggested that not only vacancies but also nitrogen doping have an influence on the oxygen precipitate profile. In addition. the relevant mechanism is discussed.
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