Microstructure and mechanical properties of nanoscale Cu/Ni multilayers

X.Y. Zhu,X.J. Liu,R.L. Zong,F. Zeng,F. Pan
DOI: https://doi.org/10.1016/j.msea.2009.09.058
2010-01-01
Abstract:The microstructure, hardness and creep behavior of Cu/Ni multilayers were investigated by X-ray diffraction, transmission electron microscopy and nanoindentation. The results show that the multilayers with a good modulation structure formed coherent superlattice at low periodicity. The strength increases as the periodicity falls from 17.5nm to 7.0nm, which can be well described by a CLS model. After that, the strength reaches a peak value of 2.53GPa at the smallest periodicity of 3.5nm. This value approximately equals to the theoretical peak strength predicted by a coherent stresses model. The stress exponent extracted from nanoindentation creep test varies from 2.20 to 6.87, indicating a dislocation glide–climb creep mechanism. The variation in the stress exponent with decreasing periodicity is discussed and ascribed to a change of the dominating rate from climb-controlled to eventually glide-controlled events.
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