Abstract:The electroplated diamond wire saw has been widely used in the production of semiconductors, photovoltaic devices, etc. Composite electroplating is an important process in the production of electroplated diamond wire saws. The utilization of nickel (Ni)-coated diamonds is a widely adopted approach to enhance the efficiency of the composite electroplating process employed in the manufacturing of wire saws. However, the pristine diamond does not chemically react with Ni, and the interfacial bonding strength between the Ni coating and the diamond is relatively weak. This frequently results in the detachment of diamonds from the Ni coating during the cutting process. To solve this problem, titanium (Ti) -coated diamonds were used in the preparation of wire saws. We had specially developed a vacuum slow evaporation technology to produce diamond micro -powder (8 mu m) with uniform conductive Ti coatings that were firmly bonded with diamond through the interfacial product TiC. A series of electrochemical test results were used to demonstrate the effect of Ti coating on the composite electroplating process. The linear scanning voltammetry curves showed that the addition of Ti -coated diamond shifted the overpotential of composite electroplating in a positive direction, so it promoted the electrodeposition reaction more than diamond powder. The electrochemical impedance spectroscopy revealed that the conductive Ti -coated diamond reduced the charge transfer resistance during composite electroplating. The Ti -coated diamond micro -powder was completely enveloped by an electroplated Ni layer, and TiC formed between the Ti coating and the diamond provided a stronger interfacial bonding force compared to that of the Ni-coated diamond micro -powder. After cutting, the Ti -coated diamond was found not to fall off the wire saw. The use of Ticoated diamond micro -powder as an abrasive will significantly improve the product quality of mass-produced electroplating diamond wire saws.

Research on Endless Wire Saw Cutting of Al<sub>2</sub>O<sub>3</sub>/TiC Ceramics

Research on the Influence of Alumina Ceramic Microstructure on Diamond Wire Sawing

A Machining Science Approach to Dental Cutting of Glass Ceramics Using an Electric Handpiece and Diamond Burs

Theoretical and Experimental Investigation on Inclined Ultrasonic Elliptical Vibration Cutting of Alumina Ceramics

Research On Wear Behavior Of Atc Cermet Material

Preparation of Ultra-Fine ATC Ceramics and Analysis of Its Dry-Sliding Wear Behavior

Material Removal Mechanisms of Polycrystalline Silicon Carbide Ceramic Cut by a Diamond Wire Saw

The Surface Quality of Monocrystalline Silicon Cutting Using Fixed Abrasive Diamond Endless Wire Saw.

Multi-Wire Sawing of Translucent Alumina Ceramics

Effect of SiC Addition to Al2O3 Ceramics Used in Cutting Tools

Preparation of Al2O3/Ti(C,N)/ZrO2/CaF2@Al(OH)3 Ceramic Tools and Cutting Performance in Turning

Ti(C,N) containing Al O cermet cutting tool

Removal Mechanism in Wire-Sawing of Hard-Brittle Material

Ti-coated Diamond Micro-Powder for the Manufacture of the Electroplated Diamond Wire Saw

Cutting Performance and Tool Wear of SiAlON and TiC-whisker-reinforced Si3N4 Ceramic Tools in Side Milling Inconel 718

Experiment study on electroplated diamond wire saw slicing single-crystal silicon

Unlubricated Friction and Wear Behaviors of Al2O3/TiC Ceramic Cutting Tool Materials from High Temperature Tribological Tests

Cutting Performance and Wear Mechanism of Submicron and Ultrafine Ti(C, N)-based Cermets

Investigation on the Performance of Spark Plasma Sintered Ultrafine WC-Co Cemented Carbide End Mills During High-Speed Precision Milling of Ti-6Al-4V Alloy

A Study of Slicing Process with Thin Diamond Wire(Grinding Technology)

Laser Ablation Study of Cutting Ceramics with Consideration of the Beam Inclination Angle

Research on Endless Wire Saw Cutting of Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;/TiC Ceramics