Modeling the Impact of Stress on Silicon Processes and Devices

V Moroz,N Strecker,XP Xu,L Smith,I Bork
DOI: https://doi.org/10.1016/s1369-8001(03)00068-4
IF: 4.1
2003-01-01
Materials Science in Semiconductor Processing
Abstract:This paper discusses different aspects of modeling the impact of stress on silicon processes and devices. The models account for the stresses due to the thermal mismatch during the temperature ramps, volume expansion and shrinkage, lattice mismatch stress due to the material composition and impurities in the lattice. It is important to simulate the evolution of the stresses coming from different sources in order to determine total stress distribution during the process flow. The peak stresses generated during the process steps might create extended defects, while the residual stresses at the end of the process flow determine the electrical performance of the device.
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