Influences of the Annealing Temperature on Resistance Temperature Characteristics of Mn-Co-Ni-O NTC Thin Films

Li Zhangheng,Yang Chuanren,Zhang Jihua,Chen Hongwei,Zhao Qiang

DOI: https://doi.org/10.3969/j.issn.1671-4776.2012.11.010

2012-01-01

Abstract:The sputtering target was made by traditional ceramic technology.Mn-Co-Ni-O negative temperature coefficient(NTC) films were prepared on the Al2O3 substrate by RF magnetron sputtering.Using X ray diffraction(XRD) and atomic force microscope(AFM),the structure and morphology of the NTC films prepared under different annealing temperatures were characterized.The films were made into the NTC thermistor with 0805 specification through processes such as evaporating electrode,internal electrode patterning,depositing SiO2 passivation layer,etc.The properties of the device were tested by the high-low temperature test chamber and other instruments,and the effect of the annealing temperature on the film resistance temperature cha-racteristic was studied.The results show that the grains grow gradually with the increase of the annealing temperature.When the annealing temperature is 950 ℃,the grain size uniformity is better and the surface roughness is lower,and the material constant B increases with the increase of the annealing temperature.