Abstract:3D surface conformal circuits are widely utilized in the fabrication of communication, automotive, medical and confidential electronic products. Special techniques, like the three-dimensional molded interconnect devices (3D-MID) technology, have been developed for manufacturing of the conformal circuits on the surfaces of injection molded plastic structures with complicated 3D shapes. However, the 3D-MID fabrication of conformal circuits involves an electro-/chemical plating process. Due to environmental protection requirements and its incompatibility with traditional electronic manufacturing processes, the application of this technique is largely limited. In this work, surface conformal circuits were fabricated additively by a modified screen-printing technology. An adaptive partition principle was proposed for reconstructing the complex 3D structure surfaces. Flexible screen receptacles were used instead of the traditional rigid ones. Nano-silver pastes were applied for the circuit printing. The obtained conformal circuit has a length range of 142~300 mm and a maximum aspect ratio of 320:1. The circuit thickness could be controlled in the range of 3-10 μm . Line width deviation was less than ± 50 μm. Linewidth consistency was better than ± 43 μm. The resistivity of the connection wires printed by the nano-silver paste were 16.2 ± 0.2 μΩ•cm. The curvatures of the 3D surfaces covered by the conformal circuits changed from -1000 m-1 to 1000 m-1. After being stored at - 40 °C and 150 °C for 72 hours, no obvious deformation, peel-off and degradation in electrical properties were detected. By using conformal circuits, the structural design of an LED luminaire has been improved to achieve miniaturization and better heat dissipation. The modified screen-printing technology presented is a cheap and reliable method for fabricating complex 3D conformal circuits and it is well compatible to traditional electronic manufacturing processes.

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