Electric Field-Driven Jetting and Water-Assisted Transfer Printing for High-Resolution Electronics on Complex Curved Surfaces

Wenzheng Sun,Zhenghao Li,Xiaoyang Zhu,Houchao Zhang,Hongke Li,Rui Wang,Wensong Ge,Huangyu Chen,Xinyi Du,Chaohong Liu,Fan Zhang,Fei Wang,Guangming Zhang,Hongbo Lan

DOI: https://doi.org/10.3390/electronics13071182

IF: 2.9

2024-03-24

Electronics

Abstract:High-resolution electronics on complex curved surfaces have wide applications in fields such as biometric health monitoring, intelligent aircraft skins, conformal displays, and biomimetics. However, current manufacturing processes can only adapt to limited curvature, posing a significant challenge for achieving high-resolution fabrication of electronics on complex curved surfaces. In this study, we propose a novel fabrication strategy that combines electric field-driven jetting and water-assisted transfer printing techniques to achieve the fabrication of high-resolution electronics on complex curved surfaces. The electric field-driven jetting enables the fabrication of high-resolution 2D electronics on sacrificial layer substrates. After dissolving the sacrificial layer, it is observed that the 2D electronics form a self-supporting structure with a certain rigidity and flexibility. During the water-assisted transfer printing process, this self-supporting structure undergoes stretching deformation with excellent conformity of the electronics to curved surfaces while effectively minimizing wrinkles. Finally, we successfully demonstrate the manufacture of 25 μm high-resolution electronics on highly curved surfaces (nautilus shell) and complex (scallop shell, stone) surfaces. The integrity of transferred circuit patterns and consistency of conductors are verified through infrared thermography analysis, confirming the feasibility of this manufacturing strategy. In addition, a protective film with strong adhesive properties is sprayed onto the transferred curved circuits to enhance their adhesion and resistance to extreme environments such as acids and alkalis. Our proposed technique provides a simple and effective new strategy for the fabrication of high-resolution electronics on complex curved surfaces.

engineering, electrical & electronic,computer science, information systems,physics, applied

What problem does this paper attempt to address?

### Problems Addressed by the Paper

The paper aims to address the challenge of manufacturing high-resolution electronic devices (approximately 50 micrometers) on complex surfaces. Traditional manufacturing techniques such as lithography, deposition, and micro-electromechanical systems (MEMS) processes face numerous difficulties when directly fabricating electronic structures on three-dimensional complex surface substrates. Therefore, a new manufacturing method needs to be developed to achieve efficient fabrication of high-resolution electronic devices on complex surfaces.

Specifically, the paper proposes a new method that combines electric field-driven jetting technology and water-assisted transfer printing to overcome the limitations of existing technologies. This method enables the fabrication of high-resolution two-dimensional electronic devices and transfers them onto complex surfaces through water-assisted transfer printing, ensuring high conformality and good adhesion of the electronic devices to the surfaces. Additionally, this method can reduce wrinkles generated during the transfer from a two-dimensional plane to a non-developable surface, thereby improving the integrity and consistency of the electronic devices.

### Main Contributions

1. **Manufacturing of High-Resolution Electronic Devices**: High-resolution two-dimensional electronic devices are fabricated on a sacrificial layer substrate using electric field-driven jetting technology.
2. **Water-Assisted Transfer Printing**: The dissolution process of the water-soluble sacrificial layer is utilized to transfer the two-dimensional electronic devices onto complex surfaces, forming a self-supporting structure that achieves good conformality and adhesion.
3. **Reduction of Wrinkles**: The stretching deformation of the self-supporting structure reduces wrinkles during the transfer from a two-dimensional plane to a non-developable surface, improving the integrity and consistency of the electronic devices.
4. **Application Verification**: High-resolution electronic devices with a line width of approximately 25 micrometers were successfully fabricated on highly curved surfaces (such as conch shells) and complex surfaces (such as scallop shells and stones). Infrared thermal imaging analysis verified the integrity of the circuit patterns and the consistency of the conductors.

### Experimental Results

- **Microscopic Characterization**: Scanning electron microscope (SEM) images show that high-resolution electronic devices exhibit good conformality on highly curved and complex surfaces.
- **Performance Testing**: Infrared thermal imaging results indicate that high-resolution electronic devices exhibit uniform heating performance on planar substrates (glass plates), high-curvature substrates (conch shells), and arbitrary complex surface substrates (including scallop shells and stones), with no significant hotspots or dark spots.
- **Optical Transmittance**: Optical transmittance tests of curved transparent electric heaters show that high-resolution electronic devices can maintain high transmittance even after being transferred to non-developable surface substrates.

In summary, this research provides a simple and effective new manufacturing strategy suitable for fabricating high-resolution electronic devices on complex surfaces.