Recent Advances on Mechanics of Transfer Printing for Flexible and Stretchable Electronics

HongYu LUO,ChangHong LINGHU,JiZhou SONG

DOI: https://doi.org/10.1360/sspma2018-00136

2018-01-01

Abstract:Flexible and stretchable inorganic electronics, offering the high performance of conventional electronics with the ability to be deformed like a rubber, integrate inorganic electronic materials with flexible substrates and has enabled many novel applications ranging from curvilinear electronics, epidermal electronics to bio-integrated electronics. However, inorganic electronic materials (e.g., silicon) cannot be fabricated directly on a flexible substrate due to the extreme processing conditions (e.g., high temperature). To overcome this challenge, transfer printing techniques have been developed to pick up inorganic thin films from the grown substrate and transfer them onto the receiver substrate for the heterogeneous integration. This approach separates the fabrication substrate with the application substrate and provides a most promising solution for the integration of inorganic electronic materials with flexible substrates to develop flexible and stretchable electronics. This paper provides a brief review of recent advances on mechanics of transfer printing techniques for flexible and stretchable inorganic electronics including kinetically controlled transfer printing technique, shear-enhanced transfer printing technique, gecko inspired transfer printing technique, surface-relief-assisted transfer printing technique, laser-driven transfer printing technique, bending curvature controlled transfer printing technique and tape transfer printing technique. The basic concepts for each transfer printing technique are overviewed to illustrate the key roles of mechanics in the development of transfer printing techniques. Despite the successful developments of various transfer printing techniques, several challenges still exist for future transfer printing techniques with the capabilities of transfer printing of nano-devices and direct three-dimensional transfer printing in a large-scale and high-efficiency manner.