Abstract:Three-dimensional (3D) buckling assembly of flexible electronics from strategically designed two-dimensional (2D) precursor structures has enabled important applications in a variety of areas, owing to its versatile applicability to a broad range of length scales and high-performance materials, as well as to a rich diversity of 3D topologies. Rational design methods that allow direct mapping of 3D mesostructures onto unknown 2D precursor structures and loading parameters are foundational to these assembly technologies, but face scientific challenges, such as the high nonlinearity of spatial deformations and tricky bifurcation behaviors. While a few inverse design methods based on the beam theory, topology optimization and machine learning algorithms have been reported, the shape programming of freestanding 3D mesostructures/electronics with highly complex curvature distributions remains elusive. In this work, we propose a curvature programming method based on bilayer ribbon networks, along with a mold-assisted assembly strategy, as a new route to customizable freestanding 3D mesostructures and electronics. Combined mechanics modeling, finite element analyses and experimental measurements allow a clear understanding of nonlinear bending-stretching coupled deformations of bilayer ribbon networks during the 2D-to-3D transformation. A parameter domain with one-to-one mapping of the dimensionless curvature and the bending stiffness ratio is identified, offering a theoretical basis of the curvature programming. By introducing a discretization strategy, a variety of regular (e.g., circles, ellipses, spirals and toroids) and biomimetic 3D curved ribbons and mesosurfaces (e.g., mimicking wavy vines, diatoms and arbitrarily curled leaves) were inversely designed and experimentally realized. A device demonstration capable of strain/temperature sensing and micro-LEDs indication suggests application opportunities in bioelectronics and microelectromechanical systems.

Wrap-like transfer printing for three-dimensional curvy electronics

High Resolution Direct Writing Liquid Metal Patterns for Printed Stretchable Electronics

High-Resolution Rapid Prototyping of Liquid Metal Electronics by Direct Writing on Highly Prestretched Substrates

Electric Field-Driven Jetting and Water-Assisted Transfer Printing for High-Resolution Electronics on Complex Curved Surfaces

Recent Advances on Mechanics of Transfer Printing for Flexible and Stretchable Electronics

Programmable robotized ‘transfer-and-jet’ printing for large, 3D curved electronics on complex surfaces

Transfer Printing Techniques for Flexible and Stretchable Inorganic Electronics

Mechanics of Curvilinear Electronics

Laser-driven Programmable Non-Contact Transfer Printing of Objects Onto Arbitrary Receivers Via an Active Elastomeric Microstructured Stamp

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Three-Dimensional Coprinting Of Liquid Metals For Directly Fabricating Stretchable Electronics

MorphingCircuit: An Integrated Design, Simulation, and Fabrication Workflow for Self-morphing Electronics.

Magnetically Driven Non‐Contact Transfer Printing Based on a Bi‐Stable Elastomeric Stamp

Transient charge-driven 3D conformal printing via pulsed-plasma impingement

Assembly of complex 3D structures and electronics on curved surfaces

Curvature Programming of Freestanding 3D Mesostructures and Flexible Electronics Based on Bilayer Ribbon Networks

Kirigami-Inspired Deformable 3D Structures Conformable to Curved Biological Surface.

Computational Design and 3D Weaving of 2D-Printable Conformal Flexible Electronics Using Harmonic Foliation Theory

Direct Laser Writing-Based Programmable Transfer Printing via Bioinspired Shape Memory Reversible Adhesive

Fabricating 1D Stretchable Fiber-shaped Electronics Based on Inkjet Printing Technology for Wearable Applications

Programmable and Scalable Transfer Printing with High Reliability and Efficiency for Flexible Inorganic Electronics