FexSi grown with mass-analyzed low-energy dual ion beam deposition

Lifeng Liu,Nuofu Chen,Fuqiang Zhang,Chenlong Chen,Yanli Li,Shaoyan Yang,Zhikai Liu
DOI: https://doi.org/10.1016/j.jcrysgro.2003.11.092
IF: 1.8
2004-01-01
Journal of Crystal Growth
Abstract:Heavily iron-implanted silicon was prepared by mass-analyzed low-energy dual ion beam deposition technique. Auger electron spectroscopy depth profiles indicate that iron ions are shallowly implanted into the single-crystal silicon substrate and formed 35nm thick FexSi films. X-ray diffraction measurements show that as-implanted sample is amorphous and the structure of crystal is partially restored after as-implanted sample was annealed at 400°C. There are no new phases formed. Carrier concentration depth profile of annealed sample was measured by Electrochemical C–V method and indicated that FexSi film shows n-type conductivity while silicon substrate is p-type. The p–n junction is formed between FexSi film and silicon substrate showing rectifying effect.
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