Abstract:The demands for high density, fine pitch interconnections in electronics systems has seen solder-based approaches for such interconnections miniaturized to the scale of tens of micro meters. At such a small scale, such 'micro joints' may contain only one or a few grains and the resultant mechanical behaviour may not be that for a polycrystalline aggregate, but rather for a single crystal. Since the ~-Sn matrix of SnAgCu solder has a contracted body-centred tetragonal (BCT) structure, such a solder grain is expected to demonstrate a considerably anisotropic behaviour. In such cases the reliability of a Phfree solder is strongly dependent on the local microstructural features, such as the size and orientation of the grains. This thesis presents the investigation of the evolution of microstructure within a joint or at the interface and, the influence of such microstructural features on the meso-scale mechanical behaviour of the Ph-free solder. It includes Evolution of the interface between a molten solder and the Cu substrate To form a joint, the solder alloy is heated and molten, wetting a solid under-bump metallization. After solidification, layers of brittle intermetallic compounds (IMCs) are formed at the interface. In this project, facilities were set up to obtain interfacial reactants at an arbitrary moment of the liquid/solid reaction. Formation and evolution ~ during reflow of SnCu IMCs at the interface between the molten SnAgCu alloy and the Cu UBM was captured and presented for the first time. Formation of phases and IMCs with the body of a liquid SnAgCu solder during solidification The formation behaviour of basic components for a SnAgCu grain (including Sn dendrites, AIDSn and Cu6Sns IMCs) during solidification was investigated. Relationships between the growth behaviour of these components and their internal lattice orientation were studied. The characteristic growth and coupling of AIDSn IMCs and the Sn matrix to form eutectics has been elaborated and presented in this study for - 1- the first time. Based on the results, the forming process of a eutectic SnAgCu grain under the non-equilibrioum solidification condition was illustrated; and major factors that determine the lattice-orientation, size and substructure of the grain were discussed. Meso- and Micro- scale mechanical behaviour of a SnAgCu solder joint To study the size effect on the microstructure, and subsequently, the meso-scale · mechanical behaviour, solder joints were manufactured with varying geometries. Shearing tests were performed·on these meso-scale joints. The results first demonstrated that the anisotropic characteristics of a SnAgCu grain play an important role in the mechanical behaviour of both a meso-scale solder joint and the adjacent interfacial IMCs. To further investigate the micro-scale deformation and damage mechanisms, micro-mechanical tests were preformed within a SnAgCu grain. Constitutive equations for a SnAgCu grain Based on the experimental results, a crystal model was established to describe the local microstructure-dependent mechanical behaviour. The constitutive equation was implemented by means of the finite element approach, and applied in solder joints of a Flip Chip (FC) package by a multi-scale method. To describe the crystal behaviour at the higher temperature, the model was improved to account for deformations due to vacancy diffusion and thermal expansion. This model was integrated by an implicit approach, and implemented in a full three dimension (3D) finite element (FE) model.

Formation of Ag3Sn plates in SnAgCu solder bumps

Formation of Sn Dendrites and SnAg Eutectics in a SnAgCu Solder

Initial formation of CuSn intermetallic compounds between molten SnAgCu solder and Cu substrate

Evolution of CuSn Intermetallics Between Molten SnAgCu Solder and Cu Substrate

Mechanism of Ag3Sn Grain Growth in Ag/Sn Transient Liquid Phase Soldering

Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient

Morphologies and grain orientations of CuSn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints

Interactions at the planar Ag3Sn/liquid Sn interface under ultrasonic irradiation.

Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures

Liquid-state interfacial reaction of Sn-10Sb-5Cu high temperature lead-free solder and Cu substrate

Interfacial Reactions in Sn–20In–2.8Ag/Cu Couples

Thermal and Compositional Fields to Maneuver Cu 6 Sn 5 Intermetallic Growth on (111) Nanotwinned Copper Substrate

Primary Solidification Phases of the Sn-rich Sn-Ag-Cu-Ni Quaternary System

Microstructure Characterization and Mechanical Behavior for Ag3sn Joint Produced by Foil-Based Tlp Bonding in Air Atmosphere

Microstructural Evolution and Phase Transformation on Sn‐Ag Solder Alloys under High‐Temperature Conditions focusing on Ag3Sn phase

Microstructural Features and Mechanical Behaviour of Lead Free Solders for Microelectronic Packaging

In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints

Identification and Evolution of Intermetallic Compounds Formed at the Interface between In-48Sn and Cu during Liquid Soldering Reactions

Cu aggregation behavior on interfacial reaction of Sn-3.0Ag-0.5Cu/ENIG solder joints

Study on morphology and interface relationship between Ag3(Sn, In) and Cu6(Sn, In)5

Interfacial reactions with and without current stressing at Sn–Co/Ag and Sn–Co/Cu solder joints