Abstract:The addition of Ni and Zn is known to improve the properties of Sn-0.7Cu solder. However, previous research has only focused on the improvement of Sn-0.7Cu solder performance through microalloying methods, and the impact of preparation processes and microalloying on the properties of Sn-0.7Cu solder remains unclear. In this study, Sn-0.7Cu-0.1Ni-xZn solders were prepared using the directional solidification (DS) method. DS eliminates transverse grain boundaries, making it an advantageous method to study the effect of Zn content on the mechanical properties of Sn-0.7Cu-0.1Ni solder. The results showed that some CuZn intermetallic compounds (IMCs) and Cu 6 Sn 5 IMCs transformed into Cu 5 Zn 8 IMCs of better mechanical properties and (Cu,Ni) 6 (Sn,Zn) 5 IMCs of more thermodynamic stability with the increase of Zn content. The tensile results indicated that the ultimate tensile strength (UTS) and yield strength (YS) of the solders followed the same pattern as the Zn content increased. Additionally, the fracture elongation (EL) of the solders initially increased and then decreased with the increase of Zn content. The peak EL was observed at 21.9% when the Zn content was 0.5 wt%. Finally, the fracture surface analysis of the tensile specimens revealed that the solder deformation was primarily plastic, with a small degree of necking observed.

Primary Solidification Phases of the Sn-rich Sn-Ag-Cu-Ni Quaternary System

Liquidus Projections of Sn-Co-Ni and Sn-Rich Sn-Ag-Co-Ni Systems

Liquidus Projection and Solidification of the Sn-In-Cu Ternary Alloys

Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at 210°C

Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at the Sn-Rich Corner

Phase Equilibria and Solidification Properties of Sn-Cu-Ni Alloys

Liquidus Projection and Thermodynamic Modeling of a Sn-Ag-Zn System

Directional Solidification and Liquidus Projection of the Sn-Co-Cu System

Liquidus Projection of the Ternary Ag–Sn–Ni System

Liquidus Projection and Thermodynamic Modeling of Sn–Zn–Cu Ternary System

Phase Equilibria and Solidification of Ternary Sn–Bi–Ag Alloys

Phase Equilibria of the Sn–Zn–Cu Ternary System

Phase Equilibria of Sn-Co-Cu Ternary System

Mechanical properties and intermetallic compound formation at the Sn/Ni and Sn-0.7wt.%Cu/Ni joints

Dissolution and Interfacial Reactions of (cu,ni)6sn5 Intermetallic Compound in Molten Sn-Cu-Ni Solders

Phase Equilibria of Sn–Sb–Cu System

Intermetallic compound evolution and mechanical properties of Sn-0.7Cu-0.1Ni-xZn lead-free solder alloys prepared by directional solidification

Interfacial reactions in the Sn–9Zn–( x Cu)/Cu and Sn–9Zn–( x Cu)/Ni couples

Interfacial reactions in the Sn–9Zn–(<i>x</i>Cu)/Cu and Sn–9Zn–(<i>x</i>Cu)/Ni couples

Solid/solid Interfacial Reactions Between Sn–0.7 Wt% Cu and Ni–7 Wt% V

Thermodynamic Properties and Phase Equilibria of Sn–Bi–Zn Ternary Alloys