Phase Equilibria and Solidification Properties of Sn-Cu-Ni Alloys

Chih-Hao Lin,Sinn-Wen Chen,Chao-Hong Wang
DOI: https://doi.org/10.1007/s11664-002-0182-8
IF: 2.1
2002-01-01
Journal of Electronic Materials
Abstract:Ternary Sn-Cu-Ni alloys were prepared and annealed at 240°C. The annealed alloys were metallographically examined and the equilibrium phases formed were identified on the basis of compositional determinations and x-ray diffraction (XRD) analysis. The isothermal section of the ternary Sn-Cu-Ni system at 240°C was proposed on the basis of experimental results of this study and related information on phase equilibrium available in the literature. The binary compounds, Cu 6 Sn 5 , Ni 3 Sn 2 , and Ni 3 Sn 4 , have very extensive ternary solubility. Continuous solid solutions form between Cu and Ni as well as between Cu 3 Sn and Ni 3 Sn. In addition to the isothermal section, the liquidus projection of the Sn-Cu-Ni system was determined based on results from the existing literature. Interfacial reactions between Sn-Cu alloys and Ni substrate and the primary solidification phases of various Sn-Cu-Ni alloys were also examined in this study.
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