Liquidus Projection and Solidification of the Sn-In-Cu Ternary Alloys

Shih-Kang Lin,Ching-Feng Yang,Shyr-Harn Wu,Sinn-Wen Chen

DOI: https://doi.org/10.1007/s11664-008-0380-0

IF: 2.1

2008-01-01

Journal of Electronic Materials

Abstract:Sn-In alloys are promising low-melting-point Pb-free solders. Knowledge of the ternary Sn-In-Cu liquidus projection is important for Sn-In solder applications. Sn-In-Cu ternary alloys were prepared and their primary solidification phases and phase-transformation temperatures during heating were determined. The liquidus projection of the Sn-In-Cu ternary system was determined based on the primary solidification phase at different compositional regimes, the phase-transformation temperatures of the ternary alloys, the phase boundaries and reaction temperatures of the constituent binary systems, and the available ternary Sn-In-Cu data in the literature. No ternary compound was found in the as-cast alloys. The Sn-In-Cu liquidus projection has 11 primary solidification phase regions and seven ternary invariant reactions with the liquid phase, and η-(Cu6Sn5,Cu2In) has a very large compositional regime as the primary solidification phase. A very interesting phenomenon that was also observed is that the solidification paths of some Sn-In-Cu alloys surpass the liquidus trough after their intersections.